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Telit ME310G1W205T060100 $ 0.00000 0.0 USD	Telit ME310G1WV03T040700 $ 0.00000 0.0 USD	Quectel BG77LA-64-SGNS $ 0.00000 0.0 USD	Quectel BG770AGLAA-N06-SGNSA $ 0.00000 0.0 USD
Quectel BG770AGLAA-N06-TB0AA $ 0.00000 0.0 USD	Quectel BG955AGLAA-N06-TA0AA $ 0.00000 0.0 USD	Quectel BG955AGLAA-N06-SGNSA $ 0.00000 0.0 USD	Quectel BG950SGL00AA-8N-SGNSA $ 0.00000 0.0 USD
Quectel BG950SGL00AA-8N-TB0AA $ 0.00000 0.0 USD	Telit LE910C1NF13T137200 $ 0.00000 0.0 USD	Telit LE910C1NF12T127200 $ 0.00000 0.0 USD	Telit LE910C1NF08T087600 $ 0.00000 0.0 USD
Telit LE910C1NF06T067200 $ 0.00000 0.0 USD	256Mbit 3.3V SPI NOR Quad I/O $ 1.57143 1.57143 USD	SIM7600G R2 Module $ 35.71429 35.714290000000005 USD	The SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. $ 39.28571 39.28571 USD
The SIM7600-H series is the LTE Cat 4 module which supports wireless communication modes of LTE-TDD/ LTE-FDD/HSPA+/GSM/GPRS/EDGE etc. It supports maximum 150Mbps downlink rate and 50Mbps uplink rate. $ 35.71429 35.714290000000005 USD	The SIM7670/SIM7672 series is the LTE Cat 1bis module based on the latest QCX216 chipset that supports wireless communication modes of LTE-FDD/LTE-TDD. It supports maximum 10Mbps downlink rate and 5Mbps uplink rate. $ 15.00000 15.000000000000002 USD	The SIM7670/SIM7672 series is the LTE Cat 1bis module based on the latest QCX216 chipset that supports wireless communication modes of LTE-FDD/LTE-TDD. It supports maximum 10Mbps downlink rate and 5Mbps uplink rate. $ 19.28571 19.28571 USD	The SIM7670/SIM7672 series is the LTE Cat 1bis module based on the latest QCX216 chipset that supports wireless communication modes of LTE-FDD/LTE-TDD. It supports maximum 10Mbps downlink rate and 5Mbps uplink rate. $ 17.14286 17.142860000000002 USD

-40 °C

-25 °C

-40°C

-40° C

-30° C

-35° C

Yes

100,000 cycles

60,000 cycles

50,000 cycles

175,200 hours

2000Hour

5000 hours

3000Hour

2000 Hour

5000

2000

1000

-40 °C

-25 °C

LCC

Mini PCIE

LCC + LGG

LCC + LGA

LGA

LCC+LGA

4.3

4.6

4.2

4.8

3.6

4.4

3.0

3.3

2.7

3.4

3.135

3.8

1.0

2.0

1.0

2.0

1 full channel 2 used as UART in DAM applications

4.0

8.0

2000Hour

5000 hours

3000Hour

2000 Hour

105℃ @ 2000H

105℃ @ 3000H

-55 °C

-55

-40 °C

-35 C

105 °C

~ +105℃

+ 85 °C

75 C

900 mA @ 100 kHz

670 mA @ 100 kHz

800 mA @ 100 kHz

600 mA @ 100 kHz

300 mA @ 100 kHz

126 mA @ 10 kHz

20000

10000

5000

2000

500

200

1000

2000

REEL

box

18*382

140

Active

Normal production

Homonymous

Surface Mount

6.6*6.6*7.7

8.3*8.3*10.5

10.3*10.3*10.5

6.6*6.6*5.7

4.3*4.3*5.7

5.3*5.3*5.7

C=7.3

C=9.0

C=11

C=5.0

C=6

18*382

26*382

29*382

14*383

14*382

0.82

0.87

0.9

0.8

395*395*235

395*395*315

395*395*195

1000.0

500.0

2000.0

2.7V to 3.6V

1.6 V–5.5 V

1.6 V–5.5 V (timekeeping: 1.1 V–5.5 V)

SOP-8

SOIC

153-ball FBGA

BGA

153

BGA 153

153-BGA

208 mil

5.30 mm

10 years

20 years

10,000 program/erase cycles

100,000 program/erase cycles

Block Lock Protection

Volatile/Non-Volatile Locks

Software Write Protection

Password Protection

RoHS Compliant

JEDEC-standard ID: BA22h

Real-Time Clock (RTC)

Real-Time Clock Module

Typ. ±5 ppm @ 25 °C; < 5 ± 23 ppm overall

Typ. ±3.4 ppm

Supports battery/cap backup; digital offset

Auto power-switch, battery backup; auto-charging control

Programmable alarms

1 programmable alarm; timer up to 7.5 years

Typ. 0.7–0.9 µA

Backup current Typ. 300 nA @ 3 V

–40 °C to +85 °C

-25°C to +85°C (case surface)

-25 to 85°C TA

Built‑in 32 kHz XO, timer output, leap-year auto-correct, digital offset

CMOS FOUT output selectable (32.768 kHz, 1024 Hz, 1 Hz), reset output with delay, countdown timer/watchdog

1 GB (Gigabyte)

256 MB (Megabyte)

512 MB (Megabyte)

2 GB (Gigabyte)

4266 MT/s (2133 MHz)

2400 MT/s (1200 MHz)

3200 MT/s (DDR4-3200)

4266 MT/s (LPDDR4-4266)

4266 MT/s

2666 MT/s

-40°C to +105°C (Extended/Auto)

0°C to +95°C (Commercial)

Commercial (0°C to +85°C TCASE)

Commercial? (Typically -25°C to +85°C)

-25°C to +85°C

-30°C to +85°C

-40°C to +85°C

-40°C to +105°C

0°C to +85°C (TCASE)

Yes (Green)

Yes

8 Gb (Gigabit)

16 Gb (Gigabit)

2 Gb (Gigabit)

4 Gb (Gigabit)

1.1V

1.2V

10mm x 14.5mm

9mm x 14mm

933 MHz

1333 MHz

1600 MHz

2133 MHz

1.35 V

1.2 V

1.8 V

1.5 V

2.5 V

1.1 V

0 – 95 °C

0 – 85 °C

–25 °C to 85 °C

8+32

256 B

2048 B

4096 B

256

528

512

Compliant

Non-Compliant

4000

2000

6000

5000

570

1.27

500

2.27

1.6777216e+07

256000

512000

4096

Multiprotocol Modules

eMMC (embedded MultiMediaCard)

Standard DRAM Module Component

Low-Power Mobile/Embedded

100

150

130

surface

Tin

Gold

Copper, Silver, Tin

Active

NRND

Discontinued

Production

EOL

Obsolete

long-term

Aluminium

Metal

600

No SVHC

Unknown

100

150

130

Radial

SMD/SMT

Crimp

Lead Free

Contains Lead

6.5

4.5

100

25.4

ACTIVE

PRODUCTION

0.8-1.1

1.08-1.4

0.5-0.8

1.1

800

900

V575LA80CP

SOIC-8-4900X6000DE

W25Q32JVSSIQ

120 mΩ

180 mΩ

160 mΩ

260 mΩ

160

260

120

Clock, Counter

Timer, Alarm, Interrupt, Frequency output

Timer, Alarm, Interrupt, Frequency output, Sout, Time Stamp Data Event

buffer

11-11-11

13-13-13

Yes

2.0

3.0

3.1

52mA ~ 162mA

3V ~ 4.3V

3V ~ 4.6V

2.7V ~ 4.8V

3.4V ~ 4.2V

3.2V ~ 4.2V

3.8

3.3

3.6

Sensitivity

-159dBm

(S) Small

(M) Medium

(L) Large

(XL) X-Large

Universal (Large)

12.1"

20%

30%

0.2

-40 °C

-55 °C

-55

-40

-40 °C

-35

-30 °C

LVCMOS

Crystal

0.14

10.0076

13.4874

10.2108

6.1976

7.6962

10.4902

670

800

600

300

900

1-bit, 4-bit, or 8-bit configurable

1.35

1.5

1.0

2.0

Price Range

Clear Filters